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Advances in Modeling and Design of Adhesively Bonded Systems

Limba englezăengleză
Carte Copertă tare
Carte Advances in Modeling and Design of Adhesively Bonded Systems S Kumar
Codul Libristo: 02069572
Editura John Wiley & Sons Inc, iulie 2013
The book comprehensively charts a way for industry to employ adhesively bonded joints to make system... Descrierea completă
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The book comprehensively charts a way for industry to employ adhesively bonded joints to make systems more efficient and cost-effective§Adhesively bonded systems have found applications in a wide spectrum of industries (e.g., aerospace, electronics, construction, ship building, biomedical, etc.) for a variety of purposes. Emerging adhesive materials with improved mechanical properties have allowed adhesion strength approaching that of the bonded materials themselves. Due to advances in adhesive materials and the many potential merits that adhesive bonding offers, adhesive bonding has replaced other joining methods in many applications.§Containing nine articles written by world-renowned experts, the book deals with the advances in theoretical and computational modeling as well as the design and experimental aspects of adhesively bonded structural systems. Stress analysis and strength prediction of adhesively bonded structural systems, considering a range of material models under a variety of loading conditions, are discussed. Finite element modeling using macro-elements is elaborated on. Recent developments in modeling and experimental aspects of bonded systems with graded adhesive layers and dual adhesives are described. Simulation of progressive damage in bonded joints is addressed. A novel vibration-based approach to detect disbonding and delamination in composite joints is also discussed.§Readership§The book is central to a range of engineers including mechanical, reliability, construction and surface engineers as well as materials scientists who are engaged in the mechanics of structural adhesive joints. Industries that will use this book include aerospace, electronics, biomedical, automotive, ship building, and construction.

Informații despre carte

Titlu complet Advances in Modeling and Design of Adhesively Bonded Systems
Autor S Kumar
Limba engleză
Legare Carte - Copertă tare
Data publicării 2013
Număr pagini 280
EAN 9781118686379
ISBN 1118686373
Codul Libristo 02069572
Greutatea 514
Dimensiuni 242 x 161 x 21
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